Lowongan Kerja Senior Staff Engineer Encapsulation Infineon Technologies AG Terbaru di Batam

Info Terbaru Lowongan Kerja Senior Staff Engineer Encapsulation Batam Oktober 2026 di Infineon Technologies AG. Selamat Siang buat agan yang sedang berburu pekerjaan. Semoga tidak berhenti untuk mencari pekerjaan yang sesuai dengan minat Anda. Memang terkadang mencari pekerjaan yang sesuai sangatlah tidak mudah di tahun 2026 ini. Pada kesempatan ini admin akan memberikan informasi Lowongan Kerja Senior Staff Engineer Encapsulation Batam Oktober 2026 di Infineon Technologies AG. Berikut ini info lebih detail mengenai Lowongan Kerja Senior Staff Engineer Encapsulation Batam Oktober 2026 Infineon Technologies AG.

Lowongan Kerja Senior Staff Engineer Encapsulation Batam Oktober 2026 Infineon Technologies AG

Berikut ini adalah persyaratan yang harus Anda penuhi untuk mendaftar Lowongan Kerja Senior Staff Engineer Encapsulation Batam Oktober 2026 Infineon Technologies AG yang dibuka pada 29 September 2026 ini:

#WeAreIn for jobs that impact everyone's life.

Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence.

As a Senior Staff Engineer Encapsulation in our Manufacturing and Operations team, find yourself in a high-tech world where silicon wafers evolve into cutting-edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future,
one innovation at a time.

Are you in?

Your role
Key responsibilities in your new role

• Process owner and expert who drives innovation, pre-development and development of Molding process
• Ensure timely development of robust Molding process in accordance to project timeline, yield and cost targets
• Develop unit process with compliance to requirements defined in the Process Development Handbook
• Advocate Design for Manufacturing and Design for Cost
• Demonstrate ability to solve complex problems independently with application of problem-solving tools
• Lead definition and guide process, equipment and material strategies as per alignment with the roadmap
• Support End-to-End activities of projects to ensure smooth ramp up.

Your profile
Qualifications and skills to help you succeed

• Master / bachelor’s degree in engineering and physical science
• Minimum 5 years of working experience in Mold Process Development
• Additional experience in IC Packaging Concept and Process/Equipment Engineering would be an added advantage
• Good knowledge and application: Statistical tools (JMP, CEDA, etc)
• Analytical and problem-solving skills (P/DFMEA, DMAIC, 8D Methodology)
• Proficient in planning and executing Design of Experiment (DoE)
• Good knowledge in analytical (SAT) and metrological tools (Smart Scope, Hisomet, etc)
• Hands-on knowledge/skills in molding process assembly.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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